Methods of forming magnetoresistive devices and integrated circuits

ABSTRACT

Magnetoresistive device architectures and methods for manufacturing are presented that facilitate integration of process steps associated with forming such devices into standard process flows used for surrounding logic/circuitry. In some embodiments, the magnetoresistive device structures are designed such that the devices are able to fit within the vertical dimensions of the integrated circuit associated with a single metal layer and a single layer of interlayer dielectric material. Integrating the processing for the magnetoresistive devices can include using the same standard interlayer dielectric material as used in the surrounding circuits on the integrated circuit as well as using standard vias to interconnect to at least one of the electrodes of the magnetoresistive devices.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.15/230,402 filed Aug. 6, 2016. Application Ser. No. 15/230,402 is adivisional of U.S. patent application Ser. No. 14/872,708 filed Oct. 1,2015, which issued as U.S. Pat. No. 9,412,786 on Aug. 9, 2016. Thisapplication and application Ser. Nos. 15/230,402 and 14/872,708 claimpriority to and benefit of U.S. Provisional Patent Application No.62/058,996 filed Oct. 2, 2014. The contents of application Ser. Nos.15/230,402, 14/872,708, and 62/058,996 are incorporated by referenceherein in their entirety.

TECHNICAL FIELD

The disclosure herein relates generally to magnetoresistive devices andmore particularly to the integration of such devices on integratedcircuits with other circuits.

BACKGROUND

Magnetoresistive devices such as magnetic sensors and magnetic memorycells include magnetic materials where the magnetic moments of thosematerials can be varied to provide sensing information or store data.For example, in certain magnetic memory devices, the voltage drop acrossa magnetic tunnel junction (MTJ) can be varied based on the relativemagnetic states of the magnetoresistive layers within the memory cell.In such memory devices, there is typically a portion of the memory cellthat has a fixed magnetic state and another portion that has a freemagnetic state that is controlled to be either parallel or antiparallelto the fixed magnetic state. Because the resistance through the memorycell changes based on whether the free portion is parallel orantiparallel to the fixed portion, information can be stored by settingthe orientation of the free portion. The information is later retrievedby sensing the orientation of the free portion. Such magnetic memorydevices are well known in the art.

Manufacturing magnetoresistive devices, including MTJ devices, includesa sequence of processing steps during which many layers of materials aredeposited and then patterned to form a magnetoresistive stack and theelectrodes used to provide electrical connections to themagnetoresistive stack. The magnetoresistive stack includes the variouslayers that make up the free and fixed portions of the device as well asone or more dielectric layers that provide at least one the tunneljunction for the device. In many instances, the layers of material arevery thin, on the order of a few or tens of angstroms.

In some applications, magnetoresistive devices are included on the sameintegrated circuit with additional surrounding circuitry. For example,magnetoresistive sensors may be included on an integrated circuit with amicrocontroller or other processing circuitry that utilizes theinformation collected by the sensors. In another example, magneticrandom access memory (MRAM) is included on an integrated circuit with aprocessor or some other logic circuitry. The process flows associatedwith forming magnetoresistive devices are typically unique with respectto those process steps used to form the surrounding circuitry on suchintegrated circuits. Therefore, it is desirable to providemagnetoresistive devices and techniques for manufacturing integratedcircuits that include magnetoresistive devices that allow for efficientintegration with respect to established integrated circuit manufacturingprocess flows.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates a block diagram integrated circuit device thatincludes magnetoresistive devices in accordance with an exemplaryembodiment;

FIGS. 2-6 illustrate cross-sectional views of layers included inmagnetoresistive devices and surrounding circuitry in integratedcircuits in accordance with exemplary embodiments; and

FIG. 7 is a flow chart of a method of manufacturing an integratedcircuit that includes magnetoresistive devices in accordance with anexemplary embodiments.

DETAILED DESCRIPTION

The following detailed description is merely illustrative in nature andis not intended to limit the embodiments of the subject matter or theapplication and uses of such embodiments. Any implementation describedherein as exemplary is not necessarily to be construed as preferred oradvantageous over other implementations.

For simplicity and clarity of illustration, the figures depict thegeneral structure and/or manner of construction of the variousembodiments. Descriptions and details of well-known features andtechniques may be omitted to avoid unnecessarily obscuring otherfeatures. Elements in the figures are not necessarily drawn to scale:the dimensions of some features may be exaggerated relative to otherelements to improve understanding of the example embodiments. Forexample, one of ordinary skill in the art appreciates that thecross-sectional views are not drawn to scale and should not be viewed asrepresenting proportional relationships between different layers. Thecross-sectional views are provided to help illustrate overallmagnetoresistive device structure and processing steps performed inmanufacturing such devices. Such cross-sectional views simplify thevarious layers to show their relative positioning. Moreover, whilecertain layers and features are illustrated with straight 90-degreeedges, in actuality or practice such layers may be more “rounded” orgradually sloping.

The terms “comprise,” “include,” “have” and any variations thereof areused synonymously to denote non-exclusive inclusion. The term“exemplary” is used in the sense of “example,” rather than “ideal.”

During the course of this description, like numbers may be used toidentify like elements according to the different figures thatillustrate the various exemplary embodiments.

For the sake of brevity, conventional techniques related tosemiconductor processing may not be described in detail herein. Theexemplary embodiments described herein may be fabricated using knownlithographic processes as follows. The fabrication of integratedcircuits, microelectronic devices, micro electro mechanical devices,microfluidic devices, and photonic devices involves the creation ofseveral layers of materials that interact in some fashion. One or moreof these layers may be patterned so various regions of the layer havedifferent electrical or other characteristics, which may beinterconnected within the layer or to other layers to create electricalcomponents and circuits. These regions may be created by selectivelyintroducing or removing various materials. The patterns that define suchregions are often created by lithographic processes. For example, alayer of photoresist is applied onto a layer overlying a wafersubstrate. A photo mask (containing clear and opaque areas) is used toselectively expose the photoresist by a form of radiation, such asultraviolet light, electrons, or x-rays. Either the photoresist exposedto the radiation, or that not exposed to the radiation, is removed bythe application of a developer. An etch may then be applied to theunderlying layer not protected by the remaining resist such that thelayer overlying the substrate is patterned. Alternatively, an additiveprocess can be used in which a structure is built up using thephotoresist as a template.

There are many inventions described and illustrated herein, as well asmany aspects and embodiments of those inventions. In one aspect, thedescribed embodiments relate to, among other things, methods ofmanufacturing integrated circuits that include magnetoresistive deviceshaving electrically conductive electrodes on either side of a magneticmaterial stack. While not described in detail herein, the magneticmaterial stack may include many different layers of material, where someof the layers include magnetic materials, whereas others do not. In someembodiments, the methods of manufacturing include forming the layers forthe magnetoresistive devices and then masking and etching those layersto produce a magnetic tunnel junction (MTJ) device. Examples of MTJdevices include transducers such as electromagnetic sensors as well asmemory cells.

Magnetoresistive devices such as magnetic sensors and magnetic memorycells can be included on an integrated circuit with other circuitry. Itis desirable to align with the process steps and structures associatedwith magnetoresistive devices with the process steps and circuitfeatures associated with the surrounding circuitry. In other words,integrating the manufacture of the magnetoresistive devices into thestandard process flow used to manufacture the integrated circuits can bedone in a manner that minimizes the number of additional processingsteps and materials needed during production. For example, while someprocess steps and materials associated with building magnetoresistivedevices are specific to such devices, other process steps and materialsused in manufacturing magnetoresistive devices are also used inmanufacturing the surrounding circuitry. As a specific example,conductive layers that are deposited and patterned to form the top andbottom electrodes for magnetoresistive devices can also be used to formconnective traces and interlayer connections in standard CMOS processflows.

Structures and techniques are presented herein that are directed atoptimizing the integration of the magnetoresistive device processingsteps with standard process flows for surrounding logic. Variousembodiments are disclosed that reduce the total number of processingsteps needed to manufacture such integrated circuits. For example,embodiments are presented in which standard vias associated with logiccircuitry on the integrated circuit are also used to provide connectionsto the magnetoresistive devices, thereby eliminating the need for theadditional processing steps that might be required formagnetoresistive-device-specific vias. Embodiments are also disclosed inwhich the interlayer dielectric used in the portion of the integratedcircuit that includes magnetoresistive devices is the samestandard-process-flow interlayer dielectric used in the remained of theintegrated circuit. Such reuse eliminates the need for additionalmagnetoresistive-device-specific processing and materials.

FIG. 1 illustrates an integrated circuit device 100 that includes alogic portion 110 and a magnetoresistive device portion 130. Whiledescribed as including logic circuits, logic portion 110 may includeother circuitry typically manufactured using standard process flows. Themagnetoresistive device portion 130 includes a plurality ofmagnetoresistive devices such as, for example, magnetic memory devicesor magnetic sensors. The logic portion 110 includes logic circuitelements that are inter-coupled using a plurality of metal layers. Asdiscussed in additional detail below, specific embodiments are presentedthat include at least three layers of metal, often referred to as M1,M2, and M3. Other embodiments may include four or more layers of metal.In order to provide inter-coupling between these metal layers andcircuit elements, vias are formed within the interlayer dielectricseparating the metal layers. Vias are holes in the interlayer dielectricin which conductive material is deposited in order to provide anelectrical path between the two metal layers on either side of theinterlayer dielectric.

The integrated circuit 100 is also shown to include a buffer region 120.The buffer region 120 may include dummy magnetoresistive devices thatare not intended for active operation, but may be used to facilitatecertain process steps. For example, chemical mechanical polishing (CMP)of the integrated circuit 100 can result in “dishing” where an unevensurface results due to the abrupt change from a high density ofmagnetoresistive devices in the magnetoresistive device portion 130 to alack of such devices in the logic portion 110. In one exampleembodiment, the buffer region 120 includes additional memory storageelements not used to store data. Those additional memory storageelements are patterned or tiled to maintain a desired density of memorystorage elements for a certain distance beyond the memory storageelements within the magnetoresistive device portion 130 that are used tostore data. Such dummy magnetoresistive devices are typically formed ofthe same materials used to form the magnetoresistive devices, where thedummy devices are included in the buffer region 120 to provide properseparation between the magnetoresistive devices and the logic portion110.

In other embodiments, rather than including dummy magnetoresistivedevices, unique structures composed of the same materials used tomanufacture the magnetoresistive devices can be included in the bufferregion 120 where the unique structures are specifically designed tofacilitate certain process steps. For example, materials used inmanufacturing the magnetoresistive devices can be deposited in specificpatterns within the buffer region 120 in order to facilitate chemicalmechanical polishing such that an even, flat surface results from suchpolishing. Such a flat surface helps promote subsequent deposition andpatterning steps associated with layers overlying the magnetoresistivedevices.

In some embodiments, metal included in the magnetoresistive deviceportion may be patterned such that areas containing metal geometriesexist in a regular pattern relative to the memory storage elements. Forexample, metal traces may be included every 32 columns or every 256rows. In the various embodiments discussed above and below, arrays ofmagnetoresistive devices are formed on the integrated circuit devicewith routing or other structures that use the second layer of metalinterspersed between the arrays or portions of the arrays. When metal ispatterned in close proximity to the magnetoresistive devices, the metalmay provide a certain density of metal feature geometries where it maybe desirable to maintain or gradually reduce the density of suchgeometries in order to promote uniform processing (e.g. during a CMP) ofthose areas.

Turning to FIG. 2, a cross-sectional view of a portion of an integratedcircuit 200 is presented to help illustrate certain concepts disclosedherein. The labels M1, V1, M2, V2, and M3 on the left-hand siderepresent certain vertical regions of the integrated circuit. Withrespect to the standard process flow corresponding to the logic portionof the integrated circuit, M1 corresponds to the vertical spaceassociated with the first metal layer, M2 corresponds to the verticalspace associated with the second metal layer, and M3 corresponds to thevertical space associated with the third metal layer. V1 corresponds tovertical space associated with the first interlayer dielectric betweenM1 and M2. The vias formed in this first interlayer dielectric may bereferred to as first-level vias. V2 corresponds to the vertical spaceassociated with the second interlayer dielectric between M2 and M3, andvias formed in the second interlayer dielectric may be referred to assecond-level vias.

The right-most column-like vertical structure, which is presented toillustrate the layers in a portion of the logic circuitry included onthe integrated circuit, a feature 252 (e.g. trace or other connectionpoint) in the first metal layer is electrically connected to a feature262 in the second metal layer using a first-level via 242. Similarly, afeature 212 in the third metal layer is electrically connected tofeature 262 in the second metal layer using a second-level via 222.

The left two column-like structures in FIG. 2 represent magnetoresistivedevices and associated connection circuitry that may be included on thesame integrated circuit 200. The first magnetoresistive device includesa magnetoresistive stack 231, which, as described above, typicallyincludes a plurality of layers that form one or more tunnel junctions.For example, a dielectric layer is sandwiched between a free layer and afixed layer to form a magnetic tunnel junction. While the specifics ofthe magnetoresistive stack 231 are not described in detail herein, manydifferent magnetoresistive stack implementations are known in the art,and it is contemplated that any of such magnetoresistive stackimplementations now known, or later developed, can be used inconjunction with the teachings presented herein.

The magnetoresistive device also includes a top electrode 230 and abottom electrode 232, where such electrodes are formed of conductivematerial that enables the magnetoresistive stack to be accessed bysurrounding circuitry. A first via 240, which may be referred to as anMvia, couples the bottom electrode 232 to a landing pad or trace 250 inthe first metal layer M1. Similarly, a second via 220 couples the topelectrode 230 of the magnetoresistive device to the third metal layerM3. As shown, the entire magnetoresistive device is disposed between thefirst layer of metal and the third layer of metal, thereby allowingprocessing steps corresponding to layers below the first metal layer M1and above the third metal layer M3 to be performed uniformly for theentire integrated circuit. Essentially, all of the processing for themagnetoresistive portion of the integrated circuit is compartmentalizedinto a portion of the total processing, where, before such processingbegins and after such processing is complete, the standard process flowcan be used. Additionally, some of the standard process steps andmaterials can be used in the compartmentalized portion of the processingused for the magnetoresistive portion, thereby reducing any additionalburden associated with the inclusion of magnetoresistive devices on theintegrated circuit.

In the embodiment shown in FIG. 2, the magnetoresistive device height(i.e. the total vertical dimension of the layers included in themagnetoresistive device) is shown to be less than a combined heightresulting from adding the height of the second metal layer M2 to theheight of the first interlayer dielectric layer within which the via 242is formed. The sum of the height of the first interlayer dielectriclayer and the second metal layer M2 is shown in FIG. 2 as height 270. Inone example embodiment, the height 270 is on the order of 180 nm. As canbe seen, the total height of the top electrode 230, the magnetoresistivestack 231, and the bottom electrode 232 is less than the height 270. TheMvia 240 provides additional height so that the magnetoresistive deviceheight plus the Mvia height equals the height 270. In one examplecorresponding to a height 270 of 180 nm, the stack is about 21 nm inheight, the bottom electrode is about 25 nm, and the top electrode(post-polishing) is about 60 nm, and the Mvia is about 74 nm. Thisallows the magnetoresistive device to be included on the integratedcircuit 200 in a way that minimizes the impact on the standard processflow used to form the other surrounding circuitry on the integratedcircuit. All of the layers associated with the magnetoresistive deviceare included in the vertical portion of the integrated circuitcorresponding to the second layer of metal and one layer of interlayerdielectric. As such, the spacing between the first layer of metal andthe second interlayer dielectric layer can be kept constant throughoutthe entire integrated circuit device. Similarly, the thickness of thesecond interlayer dielectric layer in which second-level via 222 isformed can be kept constant across the integrated circuit device 200.When the second interlayer dielectric is kept constant, the totalspacing between the first and third layers of metal is constant as well.

In the embodiment shown in FIG. 2, the magnetoresistive devices arecoupled to the third layer of metal M3 using the same second-level viastructures used in the logic portion of the integrated circuit 200.Thus, the via 220, which may be referred to as a TJ-via, provides aconnection between the top electrode 230 of the magnetoresistive deviceand the third layer of metal M3 at node 210. The via 220 and the via 222may be formed using a common set of processing steps. Using standardvias in the magnetoresistive device portion of the integrated circuit toprovide electrical conductivity to the top electrodes of themagnetoresistive devices is advantageous as there is no need to make amagnetoresistive-device specific via to connect the magnetoresistivedevices to the third metal layer M3. This reduces processing steps andsimplifies device manufacturing.

In other embodiments, the vias used within the magnetoresistive deviceportion of the integrated circuit may differ in some ways from thoseused in the logic portion. In such embodiments, the two different typesof vias may share some structural aspects or material composition. Forexample, the vias within the magnetoresistive device portion may differin dimensions with respect to those in the logic portion, yet both typesof vias are manufactured using the same materials and process steps. Inother embodiments, the vias in the two portions may differ in certainprocessing steps, while still including common aspects that can bemanufactured using the same materials and process steps. Thus, the via220 and the via 222 are preferably formed in a manner where at leastsome processing steps used in manufacturing are applied to the formationof each. By reusing process steps already included in the standardprocess in portions of the magnetoresistive device processing, the totalnumber of steps needed to make the integrated circuit device can bereduced, thereby increasing overall manufacturing efficiency.

In addition to using the same via structure in the magnetoresistivedevice portion and the logic portion, the same interlayer dielectricmaterial can be used in those two portions of the integrated circuit. Insome magnetoresistive device manufacturing, specialty dielectrics suchas TEOS are used in order to facilitate proper formation and function ofthe magnetoresistive devices. For example, after the layerscorresponding to the magnetoresistive device have been deposited andetched to form the magnetoresistive device, the spaces between thosedevices are often filled with TEOS. In the present disclosure, the samestandard low-dielectric constant (low-k) dielectric materialcorresponding to a standard logic process can be deposited in the logicportion of the integrated circuit device as well as the magnetoresistivedevice portion. Examples of such low-k dielectric materials includeporous silicon dioxide, fluorinated silicon dioxide, carbon-dopedsilicon dioxide, and various combinations of these materials. Thus, thesecond-level vias that couple the top electrodes of the magnetoresistivedevices to the third layer of metal (e.g. via 220) are formed within alayer of interlayer dielectric material identical to that within whichthe via 222 is formed. Similarly, the same interlayer dielectric can bedeposited after formation of the magnetoresistive devices where thatinterlayer dielectric material separates the magnetoresistive devicesincluded on the integrated circuit. By using the standard-process low-kdielectric instead of TEOS, processing is simplified as the overall setof process steps more closely approaches the set of steps associatedwith an integrated circuit that does not include magnetoresistivedevices.

As can be seen in FIG. 2, the Mvia 240 that couples the bottom electrode232 to the first metal layer M1 is shorter in height than thefirst-level vias included in the logic portion (e.g. via 242). Incontrolling the total height associated with each magnetoresistivedevice, the top electrode 230, bottom electrode 232, and vias 220 and240 are the layers having the most flexibility in terms of heightvariation. For example, while the magnetic stack 231 may be restrictedin terms of adjustability from a height perspective because thethickness of those layers greatly impacts the magnetoresistive devicecharacteristics, the height of the top and bottom electrodes 230, 232 ismore flexible and can be varied in order to ensure that the total heightof the magnetoresistive device aligns with the vertical space withinwhich the magnetoresistive device is to be placed. For example, in someembodiments, the height of the bottom electrode 232 is selected to bebetween 100 and 500 Å. Similarly, the top electrode 230, which maytypically be on the order of 800 Å, can be adjusted in height in orderto fit the magnetoresistive device into the space required. Inembodiments where the TJvia 220 is not the same via structures assecond-level via 222, the TJvia 220 height can be selected to be between40 and 1,000 angstroms. The Mvia 240 height can also be selected to bebetween 40 and 1,000 angstroms. Thus, many of the layers associated withthe magnetoresistive device have flexibility in terms of their height,thereby enabling those heights to be manipulated in order to meet therequirements to align with the standard logic process.

Notably, it may be desirable to maintain a relatively thin top electrode230 and bottom electrode 232 for the magnetoresistive devices. Becausethe bottom electrode 232 is typically etched after the layerscorresponding to the magnetoresistive stack 231 have been etched, theresidual matter associated with etching the bottom electrode can haveadverse impacts on the magnetoresistive stack 231. As such, reducing theheight of the bottom electrode 232 reduces the amount of etchingrequired for that layer, thereby reducing the residual material that mayadversely impact the magnetoresistive stack. Thus, it may be desirableto include any needed extra height in one of the via structuresassociated with the magnetoresistive device instead of expanding theheight of the top or bottom electrode.

As shown in FIG. 2, the top electrode 230, magnetoresistive stack 231,and bottom electrode 232 are positioned directly over the correspondingMvia 240. This, which may be referred to as a “coaxial design,” limitsthe total footprint of the magnetoresistive device on the integratedcircuit and allows the magnetoresistive devices to be placed in closeproximity to each other. In many integrated circuits, themagnetoresistive devices are arranged in an array that includes rows andcolumns of devices, and the minimal footprint allows for increasedmemory densities.

FIG. 3 illustrates an alternate embodiment in which the Mvia underlyingthe magnetoresistive device is eliminated, and the bottom electrode 332is expanded to fill the vertical space needed to align the totalmagnetoresistive device height with the height 270 corresponding to themetal layer 262 and interlayer dielectric layer in which the first-levelvia 242 is formed. Thus, in the embodiment shown in FIG. 3, the totalheight of the magnetoresistive device, which includes the top electrode230, the magnetoresistive stack 231, and the bottom electrode 332 isequal to the height 270. Notably, as used in this description and in theclaims that follow, the term “equal” should be understood to in ageneral sense such that tolerances or slight deviations from equivalencyare encompassed. For example, two via structures formed to have “equal”dimensions and the same material composition may vary slightly aftercompletion based on inconsistencies in processing operations.

As shown in FIG. 3, the bottom electrode 332 is also wider than theunderlying portion 250 of the first metal layer M1 in order to avoiddegradation of the metal underlying bottom electrode. Because theetching materials used to form the bottom electrode are typically verycorrosive with respect to copper or other materials that may be used forthe first metal layer M1, having a bottom electrode that covers theunderlying copper prevents the covered area from being adverselyaffected by the etchants during formation of the bottom electrode. Thus,in some embodiments the bottom electrode of each magnetoresistive devicehas a footprint that is greater than a footprint of the correspondingportion of the first metal layer on which the bottom electrode ispositioned.

In some embodiments, the second metal layer M2 is not used forinterconnections within the portion of the integrated circuit thatincludes the magnetoresistive devices. Thus, while the second level ofmetal M2 may be used for routing in the logic portion of the integratedcircuit, M2 is not used for any such routing within the magnetoresistivedevice portion. In other embodiments, routing traces in the second metallayer M2 may be included in the magnetoresistive device portion. In someembodiments those routing traces are used for interconnections withinthe magnetoresistive device portion, whereas in other embodiments, therouting traces may be used to maintain a pattern of usage of the secondmetal layer M2 in order to help with structural uniformity/consistency.For example, such second metal routing within the magnetoresistivedevice portion, while not being used to interconnect nodes electrically,can provide structural support to ensure polishing operations result ina generally flat surface.

While FIGS. 2 and 3 illustrate embodiments in which the height of themagnetoresistive device is less than or equal to the height 270corresponding to the second metal layer M2 and the first interlayerdielectric layer, FIGS. 4 and 5 illustrate embodiments in which themagnetoresistive device height is less than or equal to the height 470corresponding to the second metal layer M2 and the second interlayerdielectric layer. Notably, while the embodiments illustrated in FIGS.2-5 show the magnetoresistive devices formed at the vertical level onthe integrated circuit corresponding to the second metal layer M2, itshould be understood that in process flows that include many differentmetal layers, the magnetoresistive devices can be inserted at varyingvertical locations within the integrated circuit device structure. Forexample, if four metal layers are present, the magnetoresistive devicestructures may exist at a vertical level corresponding to the thirdmetal layer M3, or the second metal layer M2.

In FIG. 4, the Mvia 440 associated with the magnetoresistive device mayhave the same composition as the first-level via 242 used within thelogic portion of the integrated circuit device. Thus, the Mvia 440 andthe first-level via 242 are formed using a common set of a processingsteps. As shown in FIG. 4, the TJvia 420 for the magnetoresistive deviceis shorter in height then the first-level via 222 used in the logicportion of the magnetoresistive device to connect the second layer ofmetal 262 with the third layer of metal 212. The total height of themagnetoresistive device, which includes the top electrode 230, themagnetoresistive stack 231, and the bottom electrode 232, is less thanthe height 470 that corresponds to the second layer of magnetic material262 and the height of the second-level via 222 that is included in thesecond interlayer dielectric layer. Thus, while a nonstandard via 420 isneeded to couple the top electrode 232 the third layer of metal 210, thestandard-process via 440 is used to couple the bottom electrode 232 tothe first layer of metal 250. As such, a portion of the process flowassociated with the logic portion of the integrated circuit is reused asa part of the magnetoresistive device portion formation. Notably, someprocess steps used to produce the second-level via 222 may be used inthe formation of the TJvia 420, thereby further increasing theintegration of the magnetoresistive device processing into the standardprocess flow.

Turning to the embodiment illustrated in FIG. 5, the TJvia 420 of FIG. 4has been eliminated. In the embodiment illustrated in FIG. 5, the thirdlayer of metal 210 is directly connected to the top electrode 530 of themagnetoresistive device. While not shown, the footprint of the topelectrode 530 may be resized or otherwise adapted to facilitate thedirect connection the third metal layer 210. In the embodimentillustrated in FIG. 5, the height of the magnetoresistive device, whichincludes the top electrode 530, the magnetoresistive stack 231, and thebottom electrode 532, is equal to the height 470 the layer of metal 262and the via 222 in the second layer dielectric layer. The Mvia 240 ispreferably formed using the same process steps as the first-level via242. The top electrode 530 and bottom electrode 532 provide portions ofthe magnetoresistive device that can have varying heights in order toallow the total height of the magnetoresistive device to be adjusted toalign with the height 470.

FIG. 6 illustrates an embodiment in which both the TJvia and the Mviaare omitted from the magnetoresistive device interconnect. In theembodiment illustrated, the top electrode 560 for the device couplesdirectly to the third layer of metal M3 210, and the bottom electrode562 for the device couples directly to the first layer of metal M1 250.In such an embodiment, the total height of the magnetoresistive deviceis equal to the sum of the heights of the first interlayer dielectriclayer, the second layer of metal M2, and the second interlayerdielectric material layer, which is shown in FIG. 6 as height 570.

FIG. 7 is a flow chart that illustrates an exemplary embodiment of amethod of manufacturing an integrated circuit that includes a pluralityof magnetoresistive devices and surrounding circuitry. In one example,the magnetoresistive devices are spin-torque MTJ devices included inMRAM cells. The operations included in the flow chart may represent onlya portion of the overall process used to manufacture the device. Forillustrative purposes, the following description of the method in FIG. 7may refer to elements mentioned above in connection with FIGS. 1-6. Itshould be appreciated that methods may include any number of additionalor alternative tasks, the tasks shown in FIG. 7 need not be performed inthe illustrated order, and the method may be incorporated into a morecomprehensive procedure or process having additional functionality notdescribed in detail herein. Moreover, one or more of the tasks shown inFIG. 7 could be omitted from an embodiment as long as the intendedoverall functionality remains intact.

The method of manufacturing illustrated in FIG. 7 begins at 610 where afirst metal layer is deposited. Prior to the deposition of the firstmetal layer, other processing steps may have occurred corresponding tocircuits and structures underlying the magnetoresistive device portionof the integrated circuit. For example, or other aspects of themagnetoresistive device portion (e.g. select devices corresponding toeach magnetoresistive device) may have already been formed. Depositionof the metal layer at 610 includes depositing metal that will be used inboth interconnecting magnetoresistive devices as well as in thesurrounding logic or other circuitry on the integrated circuit device.In some embodiments, the deposition of the metal layer at 610 may be asingle damascene deposition.

At 612 a first interlayer dielectric layer is deposited over the firstmetal layer. At 614 the Mvias for the magnetoresistive devices areformed in the first interlayer dielectric layer. In some embodiments,forming the Mvias is separate from forming the first level vias in thelogic portion of the integrated circuit. An example of such anembodiment was described and discussed above with respect to FIG. 2 inwhich the Mvia 240 is shorter in height than the first-level via 242.Forming the Mvias may include using a single damascene copperdeposition. Note that in other embodiments, such as those illustrated inFIGS. 4 and 5, formation of the Mvias may occur at the same time as thefirst-level vias are formed in the logic portion of the integratedcircuit.

At 616, after formation of the Mvias, the layers for the electrodes andmagnetic stack of the magnetoresistive devices are deposited. Thus, theconductive material layer for the bottom electrode, the various magneticand nonmagnetic layers making up the magnetoresistive stack, and theconductive layer corresponding to the top electrode are all deposited at616. Any required hard mask can also be deposited at 616. At 618 themagnetoresistive devices are patterned and formed from the layersdeposited at 616. While generally described herein as a singledeposition and single etch process, formation of the magnetoresistivedevices can include multiple deposition, patterning, encapsulation, andetching steps.

At 620 interlayer dielectric material is deposited for the M2/V1 stack,where the interlayer dielectric material fills in the gaps between themagnetoresistive devices formed at 618. The interlayer dielectricdeposited at 620 also corresponds to the metal to layer within themagnetoresistive device portion as well as the logic portion of theintegrated circuit device. In some embodiments, the interlayerdielectric deposited at 620 is standard low-k dielectric materialassociated with standard process flows.

At 622, polishing occurs to produce a flat surface for deposition andpatterning of the second layer of metal. The polishing performed at 622may be a chemical mechanical polish (CMP) that also exposes the topelectrode of the magnetoresistive devices to allow for electricalcontact. At 624, the M2 and V1 layers are patterned. This may beaccomplished using a dual-damascene process. Thus, if the first-levelvias for the logic portion were not formed at 614, they are formed at624.

Following patterning of the second metal layer M2, interlayer dielectricfor the M3/V2 stack is deposited at 626. The interlayer dielectricmaterial deposited at 626 may be standard low-k dielectric materialassociated with the standard CMOS process flow. At 628, the M3/V2 layersare patterned. In embodiments such as that illustrated in FIG. 2, thisincludes forming the TJvias for the magnetoresistive devices using thesame process steps as are used to form the second-level vias in thelogic portion of the integrated circuit. Patterning the third layer ofmetal and forming the vias can be done using standard dual damascenemethods.

Although the described exemplary embodiments disclosed herein aredirected to various integrated circuit devices that includemagnetoresistive-based devices and methods for making same, the presentdisclosure is not necessarily limited to the exemplary embodiments,which illustrate inventive aspects that are applicable to a wide varietyof semiconductor processes and/or devices. Thus, the particularembodiments disclosed above are illustrative only and should not betaken as limitations, as the embodiments may be modified and practicedin different but equivalent manners apparent to those skilled in the arthaving the benefit of the teachings herein. Accordingly, the foregoingdescription is not intended to limit the disclosure to the particularform set forth, but on the contrary, is intended to cover suchalternatives, modifications and equivalents as may be included withinthe spirit and scope of the inventions as defined by the appended claimsso that those skilled in the art should understand that they can makevarious changes, substitutions and alterations without departing fromthe spirit and scope of the inventions in their broadest form.

1.-20. (canceled)
 21. A method of forming an integrated circuit devicecomprising: forming a first metal layer, wherein the first metal layeris patterned to support connections with a plurality of magnetoresistivedevices; forming a plurality of magnetoresistive devices by: forming abottom electrode; forming a magnetoresistive stack above the bottomelectrode such that a width of the magnetoresistive stack is differentthan a width of the bottom electrode; and forming a top electrode abovethe magnetoresistive stack; forming a first interlayer dielectric layerabove the first metal layer; forming first-level vias in the firstinterlayer dielectric layer; and forming a second metal layer over thefirst-level vias, wherein the first-level vias provide electricalconnections between a corresponding magnetoresistive device of theplurality of magnetoresistive devices and the second metal layer. 22.The method of claim 21, wherein the width of the bottom electrode isdifferent than the width of the magnetoresistive stack.
 23. The methodof claim 21, further comprising forming an M-via between the bottomelectrode and first metal layer, wherein each magnetoresistive device isformed coaxially with the M-via.
 24. The method of claim 21, whereinforming the top electrode of each magnetoresistive device of theplurality of magnetoresistive devices includes forming a top electrodecoupled directly to a respective portion of the second metal layer. 25.The method of claim 21, wherein the width of the bottom electrode isgreater than a width of the first metal layer.
 26. The method of claim21, further comprising, after the second metal layer is formed,performing a chemical-mechanical planarization, wherein thechemical-mechanical planarization exposes a surface of the top electrodeand a surface of the second metal layer.
 27. The method of claim 26,further comprising, after the chemical-mechanical planarization,depositing a plurality of second-level vias above, and in contact with,the top electrode and the second metal layer.
 28. The method of claim27, wherein a first second-level via, of the plurality of second-levelvias, is in contact with the top electrode and has a first height; and aanother second-level via, of the plurality of second-level vias, is incontact with the second metal layer and has a second height, wherein thesecond height is less than or equal to the first height.
 29. The methodof claim 27, further comprising depositing a third metal layer incontact with each second-level via of the plurality of second-levelvias.
 30. A method of forming an integrated circuit device comprising:forming a first metal layer, wherein the first metal layer is patternedto support connections with a plurality of magnetoresistive devices;forming a plurality of magnetoresistive devices by: forming a bottomelectrode; forming a magnetoresistive stack above the bottom electrode;and forming a top electrode above the magnetoresistive stack; forming afirst interlayer dielectric layer above the first metal layer; formingvias in the first interlayer dielectric layer; and forming an M-viabetween the bottom electrode and first metal layer, wherein each M-viais formed coaxially with a magnetoresistive device of the plurality ofmagnetoresistive devices.
 31. The method of claim 30, wherein the bottomelectrode, the top electrode, or both, have a width different than awidth of the magnetoresistive stack.
 32. The method of claim 30, furthercomprising forming a second metal layer over the vias, wherein the viasprovide electrical connections between a corresponding magnetoresistivedevice of the plurality of magnetoresistive devices and the second metallayer.
 33. The method of claim 32, further comprising: after the secondmetal layer is formed, performing a chemical-mechanical planarization,wherein the chemical-mechanical planarization exposes a surface of thetop electrode and a surface of the second metal layer; depositing asecond interlayer dielectric layer; forming a plurality of second-levelvias in the second interlayer dielectric layer; and depositing a thirdmetal layer in contact with each second-level via of the plurality ofsecond-level vias.
 34. The method of claim 33, wherein a second-levelvia, of the plurality of second-level vias, is in contact with the topelectrode and has a first height; and another second-level via, of theplurality of second-level vias, is in contact with the second metallayer and has a second height, and wherein the second height is lessthan or equal to the first height.
 35. The method of claim 33, whereineach second-level via of the plurality of second-level vias, is above,and in contact with, the top electrode and the second metal layer.
 36. Amethod of forming an integrated circuit device comprising: forming afirst metal layer, wherein the first metal layer is patterned to supportconnections with a plurality of magnetoresistive devices; forming aplurality of magnetoresistive devices by: forming a bottom electrode;forming a magnetoresistive stack above the bottom electrode; and forminga top electrode above the magnetoresistive stack; forming a firstinterlayer dielectric layer above the first metal layer; formingfirst-level vias in the first interlayer dielectric layer; forming asecond metal layer over the first-level vias, wherein the first-levelvias provide electrical connections between a correspondingmagnetoresistive device of the plurality of magnetoresistive devices andthe second metal layer; forming a second interlayer dielectric layerover the second metal layer; and forming second-level vias within thesecond interlayer dielectric layer, wherein the second level viasprovide electrical connections between a third metal layer and thesecond metal layer.
 37. The method of claim 36, further comprisingperforming a chemical-mechanical planarization prior to forming thesecond interlayer dielectric, wherein the chemical-mechanicalplanarization exposes a portion of the second metal layer.
 38. Themethod of claim 36, further comprising performing a chemical-mechanicalplanarization after forming the second-level vias, wherein thechemical-mechanical planarization exposes a portion of a second-levelvia.
 39. The method of claim 36, wherein each first-level via is coaxialto a corresponding second-level via.
 40. The method of claim 36, whereina width of the magnetoresistive stack is different than a width of thebottom electrode.